Generation Next: Packaging

Is Packaging the Savior of Moore's Law?

Whether 2.5D, monolithic 3D, or stacking, packaging innovation is poised to help move Moore's Law and enable the next generation of electronics. With mobile and IoT technologies in particular, packaging is often the determining factor enabling increased power, performance, and portability at aggressive cost targets. Packaging is no longer a "back-end" technology—every step of the manufacturing process (including design, materials, fabrication, inspection, assembly, and test) is involved.

The Generation Next: Packaging Pavilion will showcase companies who are advancing packaging technology across the supply chain, from design to system:

• EDA /“Design for Packaging”
• Device Fabrication and Processes: Lithography; TSV; Deposition; Etch
• Materials
• Inspection and Measurement

The Generation Next: Packaging Pavilion will be hosted in parallel with technical sessions focused on the critical issues, challenges, and solutions moving innovation in packaging
technology:

• 2.5D and 3D IC, including Monolithic 3D
• Design for Packaging
• Manufacturing Challenges: Via Fill; Thermal Management; Durability
• Failure Analysis

For more information about exhibiting opportunities within the Generation Next: Packaging pavilion, contact Nick Antonopoulos at [email protected] / +1.408.943.6986.